Semiconductor device
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A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in most applications. They conduct electric current in the solid state, rather than as free electrons across a vacuum (typically liberated by thermionic emission) or as free electrons and ions through an ionized gas.
Semiconductor devices are manufactured both as single discrete devices and as integrated circuit (IC) chips, which consist of two or more devices—which can number from the hundreds to the billions—manufactured and interconnected on a single semiconductor wafer (also called a substrate).
Semiconductor materials are useful because their behavior can be easily manipulated by the deliberate addition of impurities, known as doping. Semiconductor conductivity can be controlled by the introduction of an electric or magnetic field, by exposure to light or heat, or by the mechanical deformation of a doped monocrystalline silicon grid; thus, semiconductors can make excellent sensors. Current conduction in a semiconductor occurs due to mobile or "free" electrons and electron holes, collectively known as charge carriers. Doping a semiconductor with a small proportion of an atomic impurity, such as phosphorus or boron, greatly increases the number of free electrons or holes within the semiconductor. When a doped semiconductor contains excess holes, it is called a p-type semiconductor (p for positive electric charge); when it contains excess free electrons, it is called an n-type semiconductor (n for a negative electric charge). A majority of mobile charge carriers have negative charges. The manufacture of semiconductors controls precisely the location and concentration of p- and n-type dopants. The connection of n-type and p-type semiconductors form p–n junctions.
The most common semiconductor device in the world is the MOSFET (metal–oxide–semiconductor field-effect transistor),[1] also called the MOS transistor. As of 2013, billions of MOS transistors are manufactured every day.[2] Semiconductor devices made per year have been growing by 9.1% on average since 1978, and shipments in 2018 are predicted for the first time to exceed 1 trillion,[3] meaning that well over 7 trillion have been made to date.
Main types
[edit]Diode
[edit]A semiconductor diode is a device typically made from a single p–n junction. At the junction of a p-type and an n-type semiconductor, there forms a depletion region where current conduction is inhibited by the lack of mobile charge carriers. When the device is forward biased (connected with the p-side, having a higher electric potential than the n-side), this depletion region is diminished, allowing for significant conduction. Contrariwise, only a very small current can be achieved when the diode is reverse biased (connected with the n-side at lower electric potential than the p-side, and thus the depletion region expanded).
Exposing a semiconductor to light can generate electron–hole pairs, which increases the number of free carriers and thereby the conductivity. Diodes optimized to take advantage of this phenomenon are known as photodiodes. Compound semiconductor diodes can also produce light, as in light-emitting diodes and laser diode
Transistor
[edit]Bipolar junction transistor
[edit]Bipolar junction transistors (BJTs) are formed from two p–n junctions, in either n–p–n or p–n–p configuration. The middle, or base, the region between the junctions is typically very narrow. The other regions, and their associated terminals, are known as the emitter and the collector. A small current injected through the junction between the base and the emitter changes the properties of the base-collector junction so that it can conduct current even though it is reverse biased. This creates a much larger current between the collector and emitter, controlled by the base-emitter current.
Field-effect transistor
[edit]Another type of transistor, the field-effect transistor (FET), operates on the principle that semiconductor conductivity can be increased or decreased by the presence of an electric field. An electric field can increase the number of free electrons and holes in a semiconductor, thereby changing its conductivity. The field may be applied by a reverse-biased p–n junction, forming a junction field-effect transistor (JFET) or by an electrode insulated from the bulk material by an oxide layer, forming a metal–oxide–semiconductor field-effect transistor (MOSFET).
Metal-oxide-semiconductor
[edit]The metal-oxide-semiconductor FET (MOSFET, or MOS transistor), a solid-state device, is by far the most used widely semiconductor device today. It accounts for at least 99.9% of all transistors, and there have been an estimated 13 sextillion MOSFETs manufactured between 1960 and 2018.[4]
The gate electrode is charged to produce an electric field that controls the conductivity of a "channel" between two terminals, called the source and drain. Depending on the type of carrier in the channel, the device may be an n-channel (for electrons) or a p-channel (for holes) MOSFET. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead.
Other types
[edit]Two-terminal devices:
- DIAC
- Diode (rectifier diode)
- Gunn diode
- IMPATT diode
- Laser diode
- Light-emitting diode (LED)
- Photocell
- Phototransistor
- PIN diode
- Schottky diode
- Solar cell
- Transient-voltage-suppression diode
- Tunnel diode
- VCSEL
- Zener diode
- Zen diode
Three-terminal devices:
- Bipolar transistor
- Darlington transistor
- Field-effect transistor
- Insulated-gate bipolar transistor (IGBT)
- Silicon-controlled rectifier
- Thyristor
- TRIAC
- Unijunction transistor
Four-terminal devices:
- Hall effect sensor (magnetic field sensor)
- Photocoupler (Optocoupler)
Materials
[edit]By far, silicon (Si) is the most widely used material in semiconductor devices. Its combination of low raw material cost, relatively simple processing, and a useful temperature range makes it currently the best compromise among the various competing materials. Silicon used in semiconductor device manufacturing is currently fabricated into boules that are large enough in diameter to allow the production of 300 mm (12 in.) wafers.
Germanium (Ge) was a widely used early semiconductor material but its thermal sensitivity makes it less useful than silicon. Today, germanium is often alloyed with silicon for use in very-high-speed SiGe devices; IBM is a major producer of such devices.
Gallium arsenide (GaAs) is also widely used in high-speed devices but so far, it has been difficult to form large-diameter boules of this material, limiting the wafer diameter to sizes significantly smaller than silicon wafers thus making mass production of GaAs devices significantly more expensive than silicon.
Gallium Nitride (GaN) is gaining popularity in high-power applications including power ICs, light-emitting diodes (LEDs), and RF components due to its high strength and thermal conductivity. Compared to silicon, GaN's band gap is more than 3 times wider at 3.4 eV and it conducts electrons 1,000 times more efficiently.[5][6]
Other less common materials are also in use or under investigation.
Silicon carbide (SiC) is also gaining popularity in power ICs and has found some application as the raw material for blue LEDs and is being investigated for use in semiconductor devices that could withstand very high operating temperatures and environments with the presence of significant levels of ionizing radiation. IMPATT diodes have also been fabricated from SiC.
Various indium compounds (indium arsenide, indium antimonide, and indium phosphide) are also being used in LEDs and solid-state laser diodes. Selenium sulfide is being studied in the manufacture of photovoltaic solar cells.
The most common use for organic semiconductors is organic light-emitting diodes.
Applications
[edit]All transistor types can be used as the building blocks of logic gates, which are fundamental in the design of digital circuits. In digital circuits like microprocessors, transistors act as on-off switches; in the MOSFET, for instance, the voltage applied to the gate determines whether the switch is on or off.
Transistors used for analog circuits do not act as on-off switches; rather, they respond to a continuous range of inputs with a continuous range of outputs. Common analog circuits include amplifiers and oscillators.
Circuits that interface or translate between digital circuits and analog circuits are known as mixed-signal circuits.
Power semiconductor devices are discrete devices or integrated circuits intended for high current or high voltage applications. Power integrated circuits combine IC technology with power semiconductor technology, these are sometimes referred to as "smart" power devices. Several companies specialize in manufacturing power semiconductors.
Component identifiers
[edit]The part numbers of semiconductor devices are often manufacturer specific. Nevertheless, there have been attempts at creating standards for type codes, and a subset of devices follow those. For discrete devices, for example, there are three standards: JEDEC JESD370B in the United States, Pro Electron in Europe, and Japanese Industrial Standards (JIS).
Fabrication
[edit]Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). It is a multiple-step photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs",[7] with the central part being the "clean room". In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks, with 11–13 weeks being the industry average.[8] Production in advanced fabrication facilities is completely automated, with automated material handling systems taking care of the transport of wafers from machine to machine.[9]
A wafer often has several integrated circuits which are called dies as they are pieces diced from a single wafer. Individual dies are separated from a finished wafer in a process called die singulation, also called wafer dicing. The dies can then undergo further assembly and packaging.[10]
Within fabrication plants, the wafers are transported inside special sealed plastic boxes called FOUPs.[9] FOUPs in many fabs contain an internal nitrogen atmosphere[11][12] which helps prevent copper from oxidizing on the wafers. Copper is used in modern semiconductors for wiring.[13] The insides of the processing equipment and FOUPs is kept cleaner than the surrounding air in the cleanroom. This internal atmosphere is known as a mini-environment and helps improve yield which is the amount of working devices on a wafer. This mini environment is within an EFEM (equipment front end module)[14] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control.[9] Fabrication plants need large amounts of liquid nitrogen to maintain the atmosphere inside production machinery and FOUPs, which are constantly purged with nitrogen.[11][12] There can also be an air curtain or a mesh[15] between the FOUP and the EFEM which helps reduce the amount of humidity that enters the FOUP and improves yield.[16][17]
Companies that manufacture machines used in the industrial semiconductor fabrication process include ASML, Applied Materials, Tokyo Electron and Lam Research.