Tung-Han Chuang received a Ph.D. in physical metallurgy from Stuttgart University, Germany, in 1983, and was a Scientific Researcher at the Max-Planck Institute of Metal Research in Stuttgart. He is presently the R & D director of Ag Materials Technology Co., LTD, Hsinchu Science Park, Hsinchu, Taiwan. He invented the Ag-alloy bonding wire for IC and LED packaging and won the 2012 R&D 100. Dr. Chuang was a Distinguished Professor at the National Taiwan University, Taipei, Taiwan, and has published 218 SCI papers with 116 technical patents.
