AlixLabs

AlixLabs

Forskning inom nanoteknik

Lund, Skåne 4 246 följare

Atomic Level Fragmentation

Om oss

Atomic Layer Etching for Nano Device Fabrication We provide an ALE-based method of manufacturing nanostructures with characteristic size below 20nm. This is a new method of nanostructure fabrication using the atomic layer etching process, which is inherently a damage-free etch process. Owing to the etching process’s selectivity to inclined surfaces, which has been recently discovered, the inclined surfaces can be used as a mask and in this way walls of tapered structures, which can be readily fabricated by e.g., dry etching or epitaxial growth, will provide masking during the atomic layer etching process. This is why this process provides access to fabrication of extremely small structures in a very precise and efficient way.

Webbplats
http://www.alixlabs.com
Bransch
Forskning inom nanoteknik
Företagsstorlek
2–10 anställda
Huvudkontor
Lund, Skåne
Typ
Privatägt företag
Grundat
2019
Specialistområden
ALE, ALD, Nano Technology, ALEtch, Lithography och semiconductor

Adresser

Anställda på AlixLabs

Uppdateringar

  • Visa organisationssidan för AlixLabs, grafik

    4 246 följare

    "#ALDALE2024 Quite the line up in the front row of the plenary session earlier today. ALD and ALE Program Chairs and Co-chairs with plenary speakers. Listening in on the ALD Innovator Awardee talk by Annelies Delabie." From right to left: Mikko Ritala (University of Helsinki) Markku Leskelä (University of Helsinki) Ivo Raaijmakers (ASM), Fred Roozeboom (AlixLabs) Dmitry Suyatin (AlixLabs) Tuomo Suntola - The Inventor of ALD From Twitter: https://lnkd.in/e4FFnTqk Heather Korff

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  • AlixLabs omdelade detta

    Visa profilen för Jonas Sundqvist, grafik

    CEO of AlixLabs AB & Senior Technology Analyst at TECHCET LLC CA & Adjunct Associate Professor at Linköping University

    We have had busy days in Helsinki presenting AlixLabs at the AVS ALD ALE 2024. Dmitry Suyatin and Fred Roozeboom has now handed over their Chairs to the Koreans for ALE 2025 - well done Gentlemen! Yoana Ilarionova gave a well received presentation on RFEA in ALE and we had great support by Jacques Kools and Jonas Klar (鍾可樂)

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  • Visa organisationssidan för AlixLabs, grafik

    4 246 följare

    ASML has unveiled its revolutionary Hyper-NA EUV technology, set to transform semiconductor manufacturing by enabling unprecedented levels of transistor density. Announced by former president Martin van den Brink at imec's ITF World event in Antwerp, Hyper-NA boosts the numerical aperture (NA) from 0.55 to 0.75. This advancement promises enhanced productivity, processing 400 to 500 wafers per hour, and reduces the complexity and cost of double patterning. Intel has already adopted High-NA systems, and other industry leaders are expected to follow. Hyper-NA EUV sets a new benchmark for chip design, driving efficiency, innovation, and long-term growth in the semiconductor industry. ASML #Semiconductor #EUV #lithography https://lnkd.in/exbHvX_a

    ASML Unveils Hyper-NA EUV: Pioneering New Frontiers in Chip Innovation and Efficiency

    ASML Unveils Hyper-NA EUV: Pioneering New Frontiers in Chip Innovation and Efficiency

    blog.baldengineering.com

  • Visa organisationssidan för AlixLabs, grafik

    4 246 följare

    AlixLabs is an Atomic Layer Etching (ALE) company. ALE’s integration with EUV lithography and patterning processes enhances the precision, selectivity, and overall quality of semiconductor manufacturing. By enabling atomic-scale control and reducing defects, ALE supports the production of advanced semiconductor devices with increasingly smaller feature sizes and more complex architectures. 🔔 For a fab manufacturing a 3 nm logic node wafer, lithography and etching contribute to 45% of the total CO2 footprint - we want to change that! 🔎 For detailed insights and specific examples, check out this recent review paper in JVSTA (Open Source): https://lnkd.in/eXba7YV3 #ALEtch #Lithography #semiconductors

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  • Visa organisationssidan för AlixLabs, grafik

    4 246 följare

    "The AI-driven accelerated Computing revolution requires almost three times as much Silicon area as traditional design. #Nvidia is overcoming the die size limitation by attaching two dies on a silicon interposer. The blistering fast stacks of High-Bandwidth Memory also require more than double the silicon area than traditional DRAM." The market demand will be pulling hard as our APS(TM) technology can be deployed for patterning both advanced Logic and the HBM DRAM dies! Thank you Claus Aasholm for insightful information! https://lnkd.in/eP-SSrCe

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  • Visa organisationssidan för AlixLabs, grafik

    4 246 följare

    A number of applications for APS(TM) can be seen here - it is all about packing narrow lines closely together at a small scale. Today ASML can do just below 10 nm dense lines - we aim beyond that! Basically, whatever ASML can do - we aim to split that in half. We want to bring back semiconductor manufacturing how it was at the 28 nm node - Litho - Etch including scaling - Litho -Etch & Split.

    Visa profilen för Hyeongwon Seo, grafik

    July 2024 ~: 3D V-RAM and V-CMOS concept, patent, and structure development. *Freelancer Until May 2022: Memory Cell Design, Technical Lead @SEC

    The situation where ultra-high-density CMOS logic circuits or SRAM devices must remain spread out in a monolayer structure on the surface of a silicon wafer creates several constraints. While some pioneering developers attempt to stack certain components of MOS transistors on top of the silicon wafer, these efforts are not simply resolved by advances in manufacturing technology or acquiring better equipment, nor by the successful development of high-performance individual devices. The more important point is that this structural innovation will exhibit processes and results that are significantly different from those of NAND memory.

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  • Visa organisationssidan för AlixLabs, grafik

    4 246 följare

    World Environment Day (WED) is an annual event celebrated on June 5th, organized by the United Nations (UN) to raise awareness and encourage action for the protection of the environment. Established in 1972 by the United Nations General Assembly during the Stockholm Conference on the Human Environment, World Environment Day has grown to become a global platform for public outreach, with participation from over 143 countries. AlixLabs' APS(TM) technology enhances environmental sustainability by improving energy efficiency, reducing material waste and carbon footprint, in future chip manufacturing. You may have heard about PFAS (Per- and Polyfluoroalkyl Substances) - Its an so called "forever chemical" with several severe implications for life in general and aquatic ecostystems - we try to avoid using or creating PFAS in our technology as there are alternatives and these are the areas we consider to improve and found alternative solutions for: 1. Photolithography: PFAS are used in photoresists and anti-reflective coatings during the photolithography process to create fine patterns on semiconductor wafers. 2. Etching and Cleaning: PFAS-based chemicals are employed in etching solutions and cleaning agents to remove unwanted material and contaminants from the wafer surfaces without damaging the delicate structures. 3. Plasma Processing: PFAS compounds are used in plasma-enhanced processes for their stability and effectiveness in etching and deposition. 4. Lubricants and Coolants: PFAS provide high-performance lubricants and coolants used in semiconductor manufacturing equipment to ensure smooth operation and heat dissipation.

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Liknande sidor

Finansiering

AlixLabs 3 rundor totalt

Senaste finansieringsrunda

Kapital

3 604 078,00 US$

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